Critical Infrastructure
DARPA's Electronics Resurgence Initiative preps a second wave — with a different focus.
ERI 2.0 pivots from architectures to packaging. That reflects where the industrial base actually needs help.
Signal Intelligence™ · generating Executive Brief
The follow-on to ERI centers on advanced packaging and chiplet ecosystems. The pivot reflects hard-won lessons about where the US industrial base is actually weakest — not design, but the ability to integrate and package at scale.
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